Introduction
Leica Geosystems is the world´s leading manufacturer of airborne solutions. As a Switzerland-based but worldwide operating company in the design, delivery and support of airborne digital and LiDAR sensors for the geospatial marketplace Leica Geosystems has developed an application for the new generation of its leading airborne digital sensor Leica ADS100 based on the Advantech´s SOM-5788 CPU module.
The Leica ADS100 provides the world's first large format CCD line with TDI (Time Delay and Integration) to increase sensitivity despite a smaller pixel size. By doubling the cycle rate, high resolution images can now be acquired at much higher ground speeds. To provide the best stabilization performance, the new Leica PAV100 gyro-stabilized mount is equipped with revolutionary adaptive control technology.
Solution
Due to meet end customer needs with higher acquisition efficiency, more applications and reduced costs, Leica Geosystems has decided that an Advantech COM express basic module meets the requirements as a module in the camera controller for the airborne sensors. The SOM-5788 module offers high performance and is the COM 125mm x 95mm form-factor which brings several new high-speed interfaces to carrier boards, such as PCIe graphics (PEG), PCIe, PCI, SATA, and SDVO. The Advantech embedded solution and Advantech services fulfilled Leica Geosystems requirements such as: quick design turnover, easy development, maintenance, migration and local support services.
System Implementation Based on the Intel ® Core ™ i7/i5/i3 Processor architecture Leica Geosystems chose the SOM-5788 with following features and support included:
- Doubling productivity, maintaining reliability and highly automated workflows: embedded Intel® Core™ i7/i5/i3 processor + QM57
- Wide range of different interfaces: PCIe x16, 7x PCIe x1 and 4x SATAII for building a common platform using an unified aircraft installation for the Leica ADS100 and the Leica RCD30.
- High resolutions images / big data transfer over high speed buses: swath width of 20’000 pixels for all multispectral bands (RGBN) and multispectral capability in forward, nadir and backward
- Big data storages: SATA SSD/HDD
- Option to use the graphic card for debugging purposes: Intel GMA supports single and dual channel 18/24-bit LVDS, HDMI, display port, VGA
- 2 DDR3-1066 memory SODIMM sockets up to 8 GB to buffer image data and ensure reliable recording
- Monitoring 24/7 important data for ensuring product reliability, testing the heat sink: SUSIAccess software for tracking tiniest temperature variations on the CPU
- More performance: CPU i7-620LE
- Harsh environment, extended temperature: -40 up to +85°C.
- Reliable airborne sensors: SOM-5788, Intel Corei7 + QM57 is available until minimum Q1 2016
- BIOS customization carrier board design
- Hot plug support for replacing components without shutting down the system: PCIe hot-plug
- Local support: European service center, German speaking support team
System Diagram
Benefits With this application Leica Geosystems is now nearly doubling productivity while maintaining reliability and highly automated workflows, that are accepted in the market. In addition, by introducing the common platform concept using a unified aircraft installation and shared peripherals between the Leica ADS100 and the Leica RCD30 Leica Geosystems is not only simplifying operation but significantly reducing cost of ownership across the sensor portfolio. Leica Geosystems can now offer cost-effective upgrade path to both existing ADS and RCD30 standalone customers. Together with Advantech´s embedded solution and its local and very quick support services Leica Geosystems could realize its vision of the world's most productive airborne digital sensor – the “Airborne Evolution”. Advantech offered the highest quality standards and minimized cost and assisted the customer further by providing additional free services:
- BIOS customization: implemented PCIe hot-plug support
- PCIe: changed the default settings etc.
- Carrier board design review: found out possible mistakesin the carrier board design where the SOM – board is placed
- Module testing before delivery to ensure very high reliability and standard
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